Thermalright LGA1700 Aluminum Anti-Warp Contact Frame with TF7 Thermal Paste (12.8 W/m·K)

Thermalright LGA1700 Aluminum Anti-Warp Contact Frame with TF7 Thermal Paste (12.8 W/m·K)

SKU: 02-0B-00-00004

Thermalright Aluminum Anti-Warp Contact Frame with TF7 Thermal Paste:LGA1700
LGA1700AM5
  • Thermal Conductivity: 12.8 W/m·K

  • Type: Contact Frame

  • Socket: LGA1700

  • Aluminum anti-warp and anti-bend frame for LGA1700

  • Compatible with Intel 12th, 13th, and 14th gen

  • Temperature reduction of 2–7°C

  • Includes TF7 thermal paste (12.8 W/m·K)

  • Black anodized finish

The Thermalright LGA1700 Contact Frame is an aluminum replacement retention bracket designed to prevent socket warping and bending on Intel 12th, 13th, and 14th generation platforms. It reduces CPU temperatures by 2–7 degrees and includes a tube of Thermalright TF7 thermal paste (12.8 W/m·K). Available in black anodized finish.

In Stock
JOD 9.75

VAT inclusive

SKU: 02-0B-00-00004

1

Warranty

Manufacturer limited warranty included. See product details for coverage length and terms.

Delivery across Jordan

Cash on delivery

Product Overview

Thermalright LGA1700 Aluminum Anti-Warp Contact Frame with TF7 Thermal Paste

The Thermalright LGA1700 Contact Frame is an aluminum replacement retention bracket engineered to prevent socket warping and bending on Intel 12th, 13th, and 14th generation platforms. By correcting mounting pressure distribution, it delivers a measured CPU temperature reduction of 2–7°C.

This kit includes a tube of Thermalright TF7 thermal paste, offering a high thermal conductivity of 12.8 W/m·K to further optimize heat transfer between the CPU and cooler.

  • Aluminum anti-warp, anti-bend frame for LGA1700
  • Compatible with Intel 12th, 13th, and 14th gen processors
  • Reduces CPU temperatures by 2–7°C
  • Includes Thermalright TF7 thermal paste (12.8 W/m·K)
  • Black anodized finish

Specifications

Thermal Conductivity
12.8 W/m·K
Type
Contact Frame
Socket
LGA1700

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