Thermalright LGA1700 Aluminum Anti-Warp Contact Frame with TF7 Thermal Paste (12.8 W/m·K)

SKU: 02-0B-00-00004

In Stock

Thermal Conductivity: 12.8 W/m·K
Type: Contact Frame
Socket: LGA1700

Aluminum anti-warp and anti-bend frame for LGA1700
Compatible with Intel 12th, 13th, and 14th gen
Temperature reduction of 2–7°C
Includes TF7 thermal paste (12.8 W/m·K)
Black anodized finish

The Thermalright LGA1700 Contact Frame is an aluminum replacement retention bracket designed to prevent socket warping and bending on Intel 12th, 13th, and 14th generation platforms. It reduces CPU temperatures by 2–7 degrees and includes a tube of Thermalright TF7 thermal paste (12.8 W/m·K). Available in black anodized finish.

Thermalright Aluminum Anti-Warp Contact Frame with TF7 Thermal Paste:LGA1700

LGA1700AM5

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In Stock

د.أ 9.75

VAT inclusive

SKU: 02-0B-00-00004

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Manufacturer limited warranty included. See product details for coverage length and terms.

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Product Overview

Thermalright LGA1700 Aluminum Anti-Warp Contact Frame with TF7 Thermal Paste

The Thermalright LGA1700 Contact Frame is an aluminum replacement retention bracket engineered to prevent socket warping and bending on Intel 12th, 13th, and 14th generation platforms. By correcting mounting pressure distribution, it delivers a measured CPU temperature reduction of 2–7°C.

This kit includes a tube of Thermalright TF7 thermal paste, offering a high thermal conductivity of 12.8 W/m·K to further optimize heat transfer between the CPU and cooler.