Thermalright TF9 Thermal Paste 1.5g, 14 W/(m·K)

SKU: 02-0B-00-00012

In Stock

Weight: 1.5g
Thermal Conductivity: 14 W/(m·K)

Thermal conductivity: 14 W/(m·K)
1.5g quantity
High-performance compound
Suitable for CPUs and GPUs

Thermalright TF9 is a high-performance thermal compound delivering 14 W/(m·K) thermal conductivity. It comes in a 1.5g syringe suited for single or multiple CPU applications. Designed to minimize the thermal interface gap between heatsinks and processors.

Visit the Thermalright Store

In Stock

د.أ 5.85

VAT inclusive

SKU: 02-0B-00-00012

Warranty

Manufacturer limited warranty included. See product details for coverage length and terms.

Free Delivery

Easy Returns

Secure Payment

Product Overview

Thermalright TF9 Thermal Paste – 1.5g, 14 W/(m·K)

Thermalright TF9 is a high-performance thermal compound formulated to minimise the thermal interface gap between a processor and its heatsink or cooler base, helping to optimise heat transfer efficiency.

With a thermal conductivity of 14 W/(m·K), TF9 sits among the higher-performing compounds available for consumer and enthusiast use. The 1.5g syringe format allows precise application and is sufficient for single or multiple CPU installations.